JPS6314473Y2 - - Google Patents

Info

Publication number
JPS6314473Y2
JPS6314473Y2 JP1977067413U JP6741377U JPS6314473Y2 JP S6314473 Y2 JPS6314473 Y2 JP S6314473Y2 JP 1977067413 U JP1977067413 U JP 1977067413U JP 6741377 U JP6741377 U JP 6741377U JP S6314473 Y2 JPS6314473 Y2 JP S6314473Y2
Authority
JP
Japan
Prior art keywords
circuit board
electronic circuit
connection
rubber
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1977067413U
Other languages
English (en)
Japanese (ja)
Other versions
JPS53161263U (en]
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1977067413U priority Critical patent/JPS6314473Y2/ja
Priority to US05/906,742 priority patent/US4211890A/en
Publication of JPS53161263U publication Critical patent/JPS53161263U/ja
Application granted granted Critical
Publication of JPS6314473Y2 publication Critical patent/JPS6314473Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/365—Assembling flexible printed circuits with other printed circuits by abutting, i.e. without alloying process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09045—Locally raised area or protrusion of insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10575—Insulating foil under component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0064—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a polymeric substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Metallurgy (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Combinations Of Printed Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)
JP1977067413U 1977-05-25 1977-05-25 Expired JPS6314473Y2 (en])

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP1977067413U JPS6314473Y2 (en]) 1977-05-25 1977-05-25
US05/906,742 US4211890A (en) 1977-05-25 1978-05-17 Electronic circuit boards

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1977067413U JPS6314473Y2 (en]) 1977-05-25 1977-05-25

Publications (2)

Publication Number Publication Date
JPS53161263U JPS53161263U (en]) 1978-12-16
JPS6314473Y2 true JPS6314473Y2 (en]) 1988-04-22

Family

ID=13344191

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1977067413U Expired JPS6314473Y2 (en]) 1977-05-25 1977-05-25

Country Status (2)

Country Link
US (1) US4211890A (en])
JP (1) JPS6314473Y2 (en])

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4303291A (en) * 1980-11-24 1981-12-01 Western Electric Company, Inc. Method of seating connector terminals on circuit board contact pads
US4602125A (en) * 1985-05-10 1986-07-22 The Bergquist Company Mounting pad with tubular projections for solid-state devices
US4688328A (en) * 1985-12-20 1987-08-25 Rca Corporation Method for fabricating a printed circuit board assembly and method for the manufacture thereof
DE4326443C2 (de) * 1993-08-06 1996-06-05 Telefunken Microelectron Folientastatur mit bedrahtetem Bauelement
DE4428320A1 (de) * 1994-08-10 1996-02-15 Duerrwaechter E Dr Doduco Kunststoffgehäuse mit einer schwingungsdämpfenden Lagerung eines bondbaren Elements
JPH09312449A (ja) * 1996-05-23 1997-12-02 Alps Electric Co Ltd 端子付き部品の取付け構造
JP5017168B2 (ja) * 2008-04-25 2012-09-05 日立オートモティブシステムズ株式会社 カメラ装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2984697A (en) * 1957-12-09 1961-05-16 Plastic Prec Parts Co Pre-wired circuit panel
US2997521A (en) * 1960-04-11 1961-08-22 Sanders Associates Inc Insulated electric circuit assembly
US3114587A (en) * 1961-10-02 1963-12-17 Adolf L Herrmann Flat cables and corresponding connector
US3251927A (en) * 1963-01-21 1966-05-17 Mencher Alexander Conductor with plastic fabric laminated insulation
JPS5212951Y2 (en]) * 1971-06-21 1977-03-23
US3971610A (en) * 1974-05-10 1976-07-27 Technical Wire Products, Inc. Conductive elastomeric contacts and connectors
JPS5211161U (en]) * 1975-07-12 1977-01-26
US4116517A (en) * 1976-04-15 1978-09-26 International Telephone And Telegraph Corporation Flexible printed circuit and electrical connection therefor

Also Published As

Publication number Publication date
JPS53161263U (en]) 1978-12-16
US4211890A (en) 1980-07-08

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